Dario Gil, Senior Vice President of IBM, and Atsuyoshi Koike, President and Tetsuro Higashi, Chairman of Rapidus, and others announce their partnership in semiconductor technology.
Dario Gil (center), senior vice president of IBM (U.S.), and Atsuyoshi Koike (second from left), president of Rapidus, and Tetsuro Higashi (far left), chairman of Rapidus, announce their alliance in semiconductor technology on December 13, 2022.
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