k Dario Gil, Senior Vice President of IBM, and Atsuyoshi Koike, President and Tetsuro Higashi, Chairman of Rapidus, and others announce their partnership in semiconductor technology. Dario Gil center, senior vice president of IBM U.S., and Atsuyoshi Koike second from left, president of Rapidus, and Tetsuro Higashi far left, chairman of Rapidus, announce their alliance in semiconductor technology on December 13, 2022. Editorial Stock Photo - Afloimages
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Dario Gil, Senior Vice President of IBM, and Atsuyoshi Koike, President and Tetsuro Higashi, Chairman of Rapidus, and others announce their partnership in semiconductor technology. Dario Gil  center , senior vice president of IBM  U.S. , and Atsuyoshi Koike  second from left , president of Rapidus, and Tetsuro Higashi  far left , chairman of Rapidus, announce their alliance in semiconductor technology on December 13, 2022.
ED

Dario Gil, Senior Vice President of IBM, and Atsuyoshi Koike, President and Tetsuro Higashi, Chairman of Rapidus, and others announce their partnership in semiconductor technology.

Dario Gil (center), senior vice president of IBM (U.S.), and Atsuyoshi Koike (second from left), president of Rapidus, and Tetsuro Higashi (far left), chairman of Rapidus, announce their alliance in semiconductor technology on December 13, 2022.

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219195251

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Editorial

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Creation date
22-05-2023

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